Shenzhen Baroy New Material Technology Co., Ltd.

SOLUTION

Glass Through-Hole (TGV) Metallization

Technology Introduction:Glass substrate has high structural integrity, low electrical loss, vibration resistance, temperature resistance and environmental durability characteristics, in the semiconductor package three-dimensional stacked chip structure, glass adapter plate has excellent electrical insulation, low manufacturing cost and good process compatibility, but glass through-hole TGV Reliable metal filling is challenging. The hole metallization scheme using traditional sputtering plating i...

More>>

Ceramic Substrate Hole Metallization

The traditional copper plating solution for hole metallization of ceramic substrates is prone to many process difficulties such as residual liquid in the hole, poor adhesion, and unsatisfied copper filling. The hole metallization of ceramic substrate is achieved by copper paste plugging technology, which is a simple process, full filling, good adhesion and very low cost.This product is sintered with micro and nano composite copper paste, which has excellent resistivity and reliability. By adding...

More>>

Glass Substrate Circuits Manufacturing

The thermal expansion coefficient of the glass substrate is less than 10ppm/k, the breakdown voltage is above 6000V/m, and the surface flatness is extremely high, and its circuit board can be used for COG packaging of high-precision and low-power chips, such as Mini-LED chips, IC chips, microprocessor chips, etc.This product uses micro-nano composite metal powder as the core of sintered copper paste or nickel paste, make glass-based circuit by additive manufacturing, which can replace single-sid...

More>>

Ceramic Substrate Circuits Manufacturing

The thermal conductivity of ceramic substrate is between 23-350w/m·k, the thermal expansion coefficient is less than 8ppm/k, and the breakdown voltage is above 6000V/m, and its is often used in the packaging of high-voltage and high-power chips, such as high-power LED spotlights, vertical laser chips, Thermoelectric Cooler, etc.Baroy take advantage of micro-nano composite metal powder as the core of sintering copper paste or silver paste, to build the ceramic substrate circuits by additive manuf...

More>>

Plugged Via Resin For Back Drill Crack Resistance Improvement

- Problem Description：The CTE of high-speed materials are different from those of FR-4 materials at high temperature condition, especially in the process of back drilling , the stress is usually concentrated at the back drilling step position, and back drill via cracks are easy to occur and caused the quality problem；- Solution：The adoption of low CTE plugged via resin can improve the adhesion between the resin itself and the substrate to reduce the internal shrinkage stress during resin curing；...

More>>

Ceramic Through-Hole (TCV) Metallization

Product Introduction:Ceramic Via Interconnect Technology (TCV for short) is a new interconnect technology used in high-density three-dimensional packaging. The ceramic substrate hole metallization scheme using traditional copper electroplating is prone to many process difficulties such as residual liquid in the hole, poor adhesion, and incomplete copper filling. The technology of copper paste plug hole is used to realize the metallization of ceramic-based holes, and the process is simple, the fi...

More>>

Solution To Back Drilling Via Failure

- Problem Description：The water absorption phenomenon generally take place at high-speed materials than standard FR4 , and the Fiberglass of back drill usually stores some water in the etching such wet process, resulting in it not easy to dry therefore easy to cause the failure of back drilling via when the gas escapes from the fiberglass during high-temperature baking;- Solution：The low-temperature curing resin is used to cure at a relatively low temperature, and the gas is shaped and sealed be...

More>>

Through-Silicon Hole (TSV) Metallization

Technology Introduction:With the increase in the number of transistors in the chip, the vertical stacking of through-silicon via packages (TSVs) breaks through the bottleneck of traditional two-dimensional integration in the field of semiconductor devices. Through three-dimensional integration, through-silicon hole TSV technology has been widely used in recent years, in which through-hole filling is a key process of resistivity and capacitance, but the aspect ratio of through-silicon hole TSV is...

More>>

Higher Reliability Improvement Of High Frequency PCB

- Problem Description：Due to the high Tg and low CTE of high-frequency CCL, the plugged via material needs to be matched with low CTE resin, because the reliability of POFV cap copper is mainly affected by CTE matching;- Solution：The adoption of low CTE modified epoxy resin can achieve high heat resistance and low CTE performance, reduce expansion and contraction at high temperature and keep the same CTE performance with the CCL which can solve the reliability problem of POFV after IR Reflow.Had...

More>>

Layers Interconnection Of High Layer High Aspect ATE Probe Cards

- Problem Description：Probe cards for semiconductor testing usually with high average layer counts (>40L), high aspect ratio( >1:30), shorter delivery time, and high reliability.- Solution：Probe card manufacturers need to produce multiple multilayer boards in batches at the same time, different circuits between each multilayer board layers can be connected by low-temperature nano-sintered conductive copper paste after lamination process, so as to achieve on time delivery.Had been adopted in mass...

More>>

Conductive Copper Paste Via Plugging Technology For Any Layers Connection HDI

- Problem Description：For HDI blind vias interconnected by any layer of high multi-layer, the blind vias are generally the shape of the via end is relatively small and the via caliber is relatively deep, and because of the electromagnetic effect during electroplating, the general current will be grabbed by the area of the via end, and the internal current cannot enter. Secondly, because there will be residual liquid inside, such as after washing, most of the water occupies the space, and the ele...

More>>

PCB Thermal Management Solution

PCB thermal conduction and heat dissipation usually through specific vias which design for heat release purposely. the current thermal conductive materials mainly include: insulation heat conduction plug resin and thermal conductive plugged via copper paste.

More>>

Nano Electric Conductive Copper Lnk Of RFID Electronic Tag & Transparent Flexible Circuits

Problem Description: For The traditional RFID electronic tag antenna has etching process, and its disadvantages and shortcoming is: the etching process is very slow, resulting in slow antenna production; Due to the use of the reduction process, a large part of the copper foil has been etched away, therefore its material and production cost is relatively high; For conductive silver paste printing, the conductivity of conductive silver paste is far inferior to copper foil, and conductive silver pa...

More>>

Void Filling Silver Paste Used For Touch Panel(Metal Mesh)

Problem Description: Capacitive touch panel determine the position of the touch point by measuring the change in capacitance between the electrodes. When the finger touches the screen, a coupling capacitor is formed between the finger and the screen surface, and the finger will draw a part of the current from the contact point, and the current is transferred to the chip through the conductive line made of the touch panel conductive silver paste to measure the change of this current to determine ...

More>>

Solution Of Heavy Copper PCB Void Filling Resin

To improve the performance of Prepreg voids filling and flowing of heavy copper design, the performance of the of the solder mask flatness and solve the problem of bubbles of outer layers , etc., the resin with low CTE and excellent thixotropic fluidity is adopted to develop an prepreg resin with high flatness and low warpage. meanwhile, it can also cope with slot filling, and resin Voids Filling can effectively solve the process bottleneck of heavy copper board in the process of lamination and ...

More>>

Solder Mask Inkjet Printing On Heavy Copper PCB

- Problem Description：For second power supply PCB and adapter PCB with large current-carrying and high voltage standing, when copper thickness > 5oz heavy copper boards, due to the relatively high copper surface of the line, the traditional dry film or wet film silk screen printing solder mask ink needs to be exposed and developed 2-3 times to achieve such heavy thickness of the specific solder mask, and the process is relatively long and no so cost effectiveness.- Solution：For 5OZ or more hea...

More>>

50um Fine Line High Precision Complement

Due to process technology, production environment and other factors, the defect rate of PCB fine lines which circuits width less than 100μm remains high , and the adaption and application of silver paste precision extrusion, can improve the repair quality and low-cost repair performance.This technology combines precision mechanical mechanisms and microscopic positioning to achieve fast and accurate extrusion operations at low cost operation. Using the precision extrusion process technology whose...

More>>

Inkjet Solder Mask Continuous Production Line Connection

- Problem Description：Traditional PCB solder mask process uses screen printing , and a large amount of organic waste liquid is generated during screen cleaning process after solder mask development.it is not green manufacturing and not environment friendly technology.- Solution：Inkjet Solder Mask printing technology can directly print graphics/pattern and instant curing according to CAD or CAM data, the screen is not needed any more process, while reducing the production equipments and producti...

More>>

High Power Mini LED Ceramic Packaging

- Background: The cost of aluminum substrate accounts for a high proportion of LED lamp finished products, and the aluminum substrate used in LED lamps can not withstand higher voltage, made products in electrical strength and withstand voltage is more prone to problems, the thermal conductivity of the dielectric layer and the thermal conductivity of the aluminum substrate finished product There is a certain difference, requiring a high conductivity, high thermal conductivity packaging material ...

More>>

Glass Base Single Size PCBs

- Background: FR4 and aluminum base account for a relatively high proportion of cost, and it is necessary to find more cost-competitive substrates as circuit carriers.At the same time, because FR4 and metal bodies are prone to plate warping at high temperatures and currents, flatness is a problem.-Solution:This innovative product adopts the full dry process, and quickly prints sintered conductive circuits and pads on the surface of high-strength tempered glass with a thickness of more than 2mm, ...

More>>

Glass Base LED Backlight Double Size PCBs

- Background: PCB as a mini LED backlight board, because the thickness of the PCB board is less than 0.4mm, when packaging the LED chip to the PCB substrate, due to the different thermal expansion coefficient of the encapsulant and the PCB material, there will be a problem of glue cracking; and the thermal conductivity of the PCB material is poor, when the number of LED chips increases, it will reduce the service life of the LED.-Solution: This innovative product adopts the full addition process...

More>>