- Problem Description：The water absorption phenomenon generally take place at high-speed materials than standard FR4 , and the Fiberglass of back drill usually stores some water in the etching such wet process, resulting in it not easy to dry therefore easy to cause the failure of back drilling via when the gas escapes from the fiberglass during high-temperature baking;

- Solution：The low-temperature curing resin is used to cure at a relatively low temperature, and the gas is shaped and sealed before the gas gathers to produce bubbles；

Had been adopted in mass production by PCB manufacturers.