The thermal conductivity of ceramic substrate is between 23-350w/m·k, the thermal expansion coefficient is less than 8ppm/k, and the breakdown voltage is above 6000V/m, and its is often used in the packaging of high-voltage and high-power chips, such as high-power LED spotlights, vertical laser chips, Thermoelectric Cooler, etc.

Baroy take advantage of micro-nano composite metal powder as the core of sintering copper paste or silver paste, to build the ceramic substrate circuits by additive manufacturing, can efficiently produce different line width and line spacing according to the circuit graphic design, compared with the traditional production process of DPC, DBC, AMB which need to go through film laminating, exposure, image development, etching, sputtering, electroplating, high temperature sintering, in most cases our additive process technology does not need electroplating and etching such kind of cumbersome processes, the same or similar reliability such as conductivity and peel strength, it saves process time, shortens delivery time, reduces waste emissions, and is more economical and environmentally friendly, it is one innovation process of green manufacturing.