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“a hundred refined steels make the fingers soft”

Materials - is a science of a thousand hammers

  • PCB Plugged Via Material
  • PCB Inkjet Printing Material
  • PCB&PCB Electric Conductive Paste
  • Ceramic & Glass Base PCB
  • Photovoltaic Materials
  • Nano Material
ProductsCeramic & Glass Base PCB
Ceramic Substrate Thick Film Circuit Processing Service
Ceramic Substrate Thick Film Circuit Processing Service
The thermal conductivity of ceramic substrates is between 23-350w/m·k, the thermal expansion coefficient is less than 8ppm/k, and the breakdown voltage is above 6000V/m, which is adaptable for build COB or CSP package IC substrates for high-voltage a...

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Ceramic Base Substrate
Ceramic Base Substrate
The thermal conductivity of ceramic base substrate is between 23-350w/m·k, the thermal expansion coefficient (CTE for short) < 8ppm/k, and the breakdown voltage is above 6000V/m, and it is mainly used in the packaging of high-voltage and high-power I...

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Glass Base Circuits Development And Production
Glass Base Circuits Development And Production
The thermal expansion coefficient of the glass substrate is less than 10ppm/k and the breakdown voltage is above 6000V/m, which can be used for circuit substrates of high-voltage components and low-power components.This innovative technology adopts t...

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  • Solution
    • Via Plugging & Interconnection
    • PCB 3D Inkjet Printing
    • Flexible Film Electronics Printing
    • Line Complement
    • Ceramic Circuits
    • Glass Circuits
    • Semiconductor
  • R&D
    • R&D Center
    • Production Center
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