Layers Interconnection Of High Layer High Aspect ATE Probe Cards

Problem Description:Probe cards for semiconductor testing usually with high average layer counts (>40L), high aspect ratio( >1:30), shorter delivery time, and high reliability.

Solution:Probe card manufacturers need to produce multiple multilayer boards in batches at the same time, different circuits between each multilayer board layers can be connected by low-temperature nano-sintered conductive copper paste after lamination process, so as to achieve on time delivery.

Had been adopted in mass production by PCB manufacturers.