Glass Through-Hole (TGV) Metallization

Technology Introduction:

Glass substrate has high structural integrity, low electrical loss, vibration resistance, temperature resistance and environmental durability characteristics, in the semiconductor package three-dimensional stacked chip structure, glass adapter plate has excellent electrical insulation, low manufacturing cost and good process compatibility, but glass through-hole TGV Reliable metal filling is challenging. The hole metallization scheme using traditional sputtering plating is prone to many problems such as poor adhesion and incomplete copper filling. Baroy New Material adopts self-developed copper paste plug hole technology to realize glass-based hole metallization processing, with simple process, full filling, good adhesion and extremely low cost. At present, it can stably realize the 25~150um glass through-hole TGV through hole metallization, and also cooperate deeply with laser equipment manufacturers to realize the microscopic glass through-hole manufacturing with high thickness to diameter ratio by using laser-induced deep etching.

This product is made of copper paste sintered with tiny particle size, which has excellent resistivity and reliability. By adding high-temperature binders and special fillers, the coefficient of thermal expansion of the hole copper and interface can be further adjusted to achieve high-reliability hole metallization.


This product is made by sintering copper paste with tiny particle size, which has excellent resistivity and reliability. By adding high temperature binder and special filler, the coefficient of thermal expansion of hole copper and interface can be further adjusted to achieve highly reliable hole metallization.


Process Flow:玻璃通孔TGV金属化加工

玻璃通孔TGV金属化加工

High Efficiency, Good Quality & Low Cost Of Plugging Process:

• Achieve high thickness to diameter ratio of small aperture low resistance conduction

• High reliability adhesion of hole copper and interface layer with low coefficient of thermal expansion

• Resistant to conventional chemical corrosion, thermal stress resistance, good weldability

• It can carry out chemical etching, surface treatment and other reprocessing processes normally and is stable and reliable

• Passed the 300°C thermal shock test, no failure after 1000 thermal cycles, and the adhesion is still stable              

       

Technlogy Advantages:

• Green environmental protection, reducing the traditional sputtering and electroplating large-scale equipment and capital investment

• The process is simple, and the glass through-hole TGV metallization is achieved by filling the conductive metal paste by printing

• Good adhesion, glass through-hole TGV metal paste contains glass powder, which improves the adhesion between metal and glass

• It can realize the metallization of glass through-hole TGV holes with high thickness to diameter ratio, and the maximum plug hole thickness to diameter ratio is as high as 20:1

• The process is convenient, the processing cycle is short, and it+ can be achieved in only three steps of printing + sintering + grinding


Specification：


Medium aluminum glass

High aluminum glass

Borosilicate glass

Quartz glass






Coefficient of Thermal Expansion

7ppm/℃

5ppm/℃

3.5ppm/℃

0.5ppm/℃

Softening Point

∽500℃

∽600℃

∽800℃

∽1700℃

Size

<250mmX350m

<250mmX350m

<250mmX350m

<250mmX350m

Thickness

0.25∽2mm

0.25∽2mm

0.2∽1mm

0.1∽1mm

Aperture

0.03∽1mm

0.03∽1mm

0.02∽1mm

0.02∽1mm

Depth-to-diameter Ratio

<20:1

<20:1

<20:1

<20:1


Application：

Glass through-hole TGV has broad application prospects, TGV can be used in optical communication, RF module, optoelectronic system integration, MEMS packaging, electronic gas amplifier, equipment fixture, medical equipment and other fields. In the glass through-hole TGV, the plug hole copper paste can be heterogeneously interconnected with the metal of the package substrate or PCB board, so as to realize multi-dimensional packaging.

玻璃通孔TGV金属化加工

 Processing Performance：

玻璃通孔TGV金属化加工