Due to process technology, production environment and other factors, the defect rate of PCB fine lines which circuits width less than 100μm remains high , and the adaption and application of silver paste precision extrusion, can improve the repair quality and low-cost repair performance.
This technology combines precision mechanical mechanisms and microscopic positioning to achieve fast and accurate extrusion operations at low cost operation. Using the precision extrusion process technology whose process precision below 50μm, repair and connect the broken circuits, especially suitable for mass production of 2mil mini-LED and touch panel fine lines repairing and fine line Complementary connection.
Manual mending equipment：
• Circuits repairing working table size can be above 400X600mm
• ±10μm registration/alignment precision by micro-scope operation
• Semi-automation pattern development operation system, easy to manipulate
• 50um high precision paste Dispensing can better control the tolerance of circuits
Conductive Silver Paste For Circuits Repairing：
• Resistivity meets electrical conductivity and impedance requirements
• Submicron particles that can achieve a 50 micron extrusion line
• Low curing temperature of 160 ℃ has little thermal impact on the plate
• Polishable copper plating for a consistent appearance
Specification：
Board Thickness | Boards size within 400X600mm all kind of boards thickness is available |
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Location Tolerance | ±10μm |
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Circuits length | <8mm |
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Dispensing Bips | 34G | 32G | 30G | 27G |
Copper Thickness | 1/5∽1/3OZ | 1/4∽1/2OZ | 1/3∽2/3OZ | 1/2∽1OZ |
Circuits width Scope | 2∽4mil | 4∽6mil | 6∽8mil | >8mil |
