PCB thermal conduction and heat dissipation usually through specific vias which design for heat release purposely. the current thermal conductive materials mainly include: insulation heat conduction plug resin and thermal conductive plugged via copper paste.
(1) Insulating heat conduction plug hole resin
PHP-5F-DR heat plug hole slurry is a one-component thermosetting heat plug hole slurry developed for the thermal conduction and heat dissipation needs of customers' high-frequency, high-power boards. It is suitable for high-power PCBs such as high-power 5G PCBs and automotive power supplies.
· High thermal conductivity, thermal conductivity≥ 3W/m.k
· Good fluidity and excellent workmanship
· High environmental reliability
· Excellent insulation performance and grinding performance
· Suitable for conventional plug hole resin process, low-cost scheme for thermal management
(2) Conductive plug hole copper paste
PHP-5F-S and PHP-5F-N are one-component, highly conductive and highly reliable. Products are used in mobile phones, digital cameras, car navigation, avionics and other electronic products to improve the thermal conductivity and heat dissipation performance of products, and improve the reliability of products.
· Volume resistivity (≤5X10-5Ω.cm)
· Excellent thermal conductivity and heat dissipation performance (thermal conductivity≥ 13W/m.K)
· High environmental reliability
· Excellent adhesion with coating
· Suitable for conventional plug hole process
