Plugged Via Resin For Back Drill Crack Resistance Improvement
Plugged Via Resin For Back Drill Crack Resistance Improvement
- Problem Description：The CTE of high-speed materials are different from those of FR-4 materials at high temperature condition, especially in the process of back drilling , the stress is usually concentrated at the back drilling step position, and back drill via cracks are easy to occur and caused t...
Solution To Back Drilling Via Failure
Solution To Back Drilling Via Failure
- Problem Description：The water absorption phenomenon generally take place at high-speed materials than standard FR4 , and the Fiberglass of back drill usually stores some water in the etching such wet process, resulting in it not easy to dry therefore easy to cause the failure of back drilling via ...
Higher Reliability Improvement Of High Frequency PCB
Higher Reliability Improvement Of High Frequency PCB
- Problem Description：Due to the high Tg and low CTE of high-frequency CCL, the plugged via material needs to be matched with low CTE resin, because the reliability of POFV cap copper is mainly affected by CTE matching;- Solution：The adoption of low CTE modified epoxy resin can achieve high heat res...
Layers Interconnection Of High Layer High Aspect ATE Probe Cards
Layers Interconnection Of High Layer High Aspect ATE Probe Cards
- Problem Description：Probe cards for semiconductor testing usually with high average layer counts (>40L), high aspect ratio( >1:30), shorter delivery time, and high reliability.- Solution：Probe card manufacturers need to produce multiple multilayer boards in batches at the same time, different circ...