Conductive Copper Paste Via Plugging Technology For Any Layers Connection HDI
Conductive Copper Paste Via Plugging Technology For Any Layers Connection HDI
- Problem Description：For HDI blind vias interconnected by any layer of high multi-layer, the blind vias are generally the shape of the via end is relatively small and the via caliber is relatively deep, and because of the electromagnetic effect during electroplating, the general current will be gra...
PCB Thermal Management Solution
PCB Thermal Management Solution
PCB thermal conduction and heat dissipation usually through specific vias which design for heat release purposely. the current thermal conductive materials mainly include: insulation heat conduction plug resin and thermal conductive plugged via copper paste.
Solution Of Heavy Copper PCB Void Filling Resin
Solution Of Heavy Copper PCB Void Filling Resin
To improve the performance of Prepreg voids filling and flowing of heavy copper design, the performance of the of the solder mask flatness and solve the problem of bubbles of outer layers , etc., the resin with low CTE and excellent thixotropic fluidity is adopted to develop an prepreg resin with hi...