Glass Substrate Circuits Manufacturing
Glass Substrate Circuits Manufacturing
The thermal expansion coefficient of the glass substrate is less than 10ppm/k, the breakdown voltage is above 6000V/m, and the surface flatness is extremely high, and its circuit board can be used for COG packaging of high-precision and low-power chips, such as Mini-LED chips, IC chips, microprocess...
Glass Base Single Size PCBs
Glass Base Single Size PCBs
- Background: FR4 and aluminum base account for a relatively high proportion of cost, and it is necessary to find more cost-competitive substrates as circuit carriers.At the same time, because FR4 and metal bodies are prone to plate warping at high temperatures and currents, flatness is a problem.-S...
Glass Base LED Backlight Double Size PCBs
Glass Base LED Backlight Double Size PCBs
- Background: PCB as a mini LED backlight board, because the thickness of the PCB board is less than 0.4mm, when packaging the LED chip to the PCB substrate, due to the different thermal expansion coefficient of the encapsulant and the PCB material, there will be a problem of glue cracking; and the ...