Ceramic Substrate Thick Film Circuit Processing Service - Shenzhen Baroy New Material Technology Co., Ltd.

Ceramic Substrate Thick Film Circuit Processing Service

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Material Information

The thermal conductivity of ceramic substrates is between 23-350w/m·k, the thermal expansion coefficient is less than 8ppm/k, and the breakdown voltage is above 6000V/m, which is adaptable for build COB or CSP package IC substrates for high-voltage and high-power IC.

This product uses sintered conductive copper paste or silver paste with micro-nano composite metal powder as the core material, and develop ceramic substrate circuit through high precision screen printing technology. high graphic/pattern accuracy, high temperature resistance, excellent resistivity and high reliability. Compared with the DPC technical solution, this process is short, cost effectively, excellent heat recycle resistance performance.

Material Advantage

The small dielectric constant and the good high frequency performance

The coefficient of thermal expansion CTE is closer to silicon

High heat resistance

High thermal conductivity

High mechanical stability, good dimensional stability

Good chemical resistance stability, can resist the erosion of acids

Good electric insulation performance and high reliability

The small dielectric constant and the good high frequency performance

The coefficient of thermal expansion CTE is closer to silicon

High heat resistance

High thermal conductivity

High mechanical stability, good dimensional stability

Good chemical resistance stability, can resist the erosion of acids

Good electric insulation performance and high reliability

Application

陶瓷基板厚膜电路加工

Material Trait

Ceramic Base Circuits Board

· More than 10 times the thermal conductivity of the aluminum substrate, especially adaptable for high-power chips packaging, such like IGBT

· Breakdown voltage above 6000V, reduce the cost of external transformer

· Better thermal stability than most organic materials

Thick Film Conductive Metal Paste

· The conductivity is 2.5μΩ·cm, which is close to pure copper

· The peel off strength is 5N/mm, which is 6 times that of conventional MCPCB

· The interface layer CTE is adjustable, can stand 1000 times Thermal Cycle, 350°C thermal shock

High Precision Screen Printing

· Develop the production of graphic circuits by only 3 process steps, low process cost

· 100% raw conductive material is used, high Material utilization

· No water pollution or contamination due to it is a dry process production

Specification

Basic Material /Substrate
	Alumina	Aluminum nitride
Coefficient of thermal expansion CTE	6.8 ppm/K	4.7ppm/K
Thermal conductivity	23 w/m·k	170 w/m·k
Dimension	<182X182mm	<120X120mm
Thickness	0.25∽1mm	0.15mm∽0.63mm
Conductive Material
	Silver Circuits	Copper Circuits
Resistivity	2.5μΩ·cm	2.5μΩ·cm
Circuits Resolution	100μm/100μm	100μm/100μm
Thickness	8∽25μm	8∽25μm
Surface Roughness	<0.3μm	<0.3μm
Adhesion	>5N/mm	>5N/mm

Basic Material /Substrate
	Alumina	Aluminum nitride
Coefficient of thermal expansion CTE	6.8 ppm/K	4.7ppm/K
Thermal conductivity	23 w/m·k	170 w/m·k
Dimension	<182X182mm	<120X120mm
Thickness	0.25∽1mm	0.15mm∽0.63mm
Conductive Material
	Silver Circuits	Copper Circuits
Resistivity	2.5μΩ·cm	2.5μΩ·cm
Circuits Resolution	100μm/100μm	100μm/100μm
Thickness	8∽25μm	8∽25μm
Surface Roughness	<0.3μm	<0.3μm
Adhesion	>5N/mm	>5N/mm

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