The thermal conductivity of ceramic base substrate is between 23-350w/m·k, the thermal expansion coefficient (CTE for short) < 8ppm/k, and the breakdown voltage is above 6000V/m, and it is mainly used in the packaging of high-voltage and high-power IC, such as high-power spotlights LED chips packaging, high power laser chips packaging, Thermo-Electric Cooler (TEC for short) substrate, etc.

Ceramic Base Substrate is made of micro-nano composite conductive copper paste sintering, copper thickness is adjustable, high temperature resistance. high reliability as well, can make up for the market gap of ceramic-based copper clad laminate which copper thickness below 125μm. With a graphics resolution of 3mil after etching, it is a low-cost alternative and replacement solution to sputtered copper plating (DPC) and plated copper on Ceramic base.