Glass Base Circuits Development And Production - Shenzhen Baroy New Material Technology Co., Ltd.

Glass Base Circuits Development And Production

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Material Information

The thermal expansion coefficient of the glass substrate is less than 10ppm/k and the breakdown voltage is above 6000V/m, which can be used for circuit substrates of high-voltage components and low-power components.

This innovative technology adopts the full dry process, take advantage of conductive copper paste as printing material, develop the circuits and pads on the surface of high-rigid Chilled glass which with a thickness of more than 2mm by quickly sintering , it is used to mount various low-power components. It is especially adaptable for the production of high-voltage driven outdoor LED text and indication signs with high electrical safety requirements.

Material Advantage

Reduces industrial waste, energy saving and emission reduction

Conductive copper paste and sintering technology to print the circuit by screen printing

Glass base material relatively lower than the one of FR4 PCB

Good rigidity and high flatness performance of glass substrate

Achieve a minimum line width and line spacing of 100um/100um

The peel off strength up to 2~3N/mm

The minimum laser drilling capacity of the glass substrate reaches 10um~15um

Reduces industrial waste, energy saving and emission reduction

Conductive copper paste and sintering technology to print the circuit by screen printing

Glass base material relatively lower than the one of FR4 PCB

Good rigidity and high flatness performance of glass substrate

Achieve a minimum line width and line spacing of 100um/100um

The peel off strength up to 2~3N/mm

The minimum laser drilling capacity of the glass substrate reaches 10um~15um

Application

玻璃基板LED广告牌

Material Trait

Chilled Glass Substrate

• Lower material cost than aluminum substrate

• The thermal conductivity is comparable to that of ordinary aluminum substrates, which can efficiently dissipate heat over a large area

• Breakdown voltage above 6000V, reduce the cost of external transformer

• Fully inorganic material, high voltage resistance; Ultraviolet aging, seawater corrosion

Thick Film Conductive Metal Paste

• Base metal circuits, no risk of ion migration

• Peel Off strength 5N/mm, 6 times that of conventional PCB

• 500°C high temperature fusion inorganic interface, thermal shock resistance, environmental aging resistance

Additive Manufacturing:/Dry Process

• complete graphics circuit development only by 3 process step, low process cost

• Conductive metal paste as raw materials is 100% used, low material cost and usage

• Fully Dry process without any water pollution, environment friendly technology

Specification

Chilled Glass Substrate		Heavy Thickness Circuits
Coefficient of thermal Expansion	9.5 ppm/K	Electric Resistance	∽80 μΩ·cm
Coefficient of Thermal Conductivity	1.1 w/m·k	Circuits Resolution	150μm/150μm
Bending Resistant	>120MPa	Thickness	8∽25μm
Breakdown Voltage	>10kV/mm	Surface Roughtness	<0.3μm
Dimension	<250X350mm	Solderablity	>98%
Thickness	1.8∽3mm	Adhesion Strength	>5N/mm

Chilled Glass Substrate		Heavy Thickness Circuits
Coefficient of thermal Expansion	9.5 ppm/K	Electric Resistance	∽80 μΩ·cm
Coefficient of Thermal Conductivity	1.1 w/m·k	Circuits Resolution	150μm/150μm
Bending Resistant	>120MPa	Thickness	8∽25μm
Breakdown Voltage	>10kV/mm	Surface Roughtness	<0.3μm
Dimension	<250X350mm	Solderablity	>98%
Thickness	1.8∽3mm	Adhesion Strength	>5N/mm

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