PHP9000-7F-H is a semi-sintered electric conductive silver paste with excellent electric conductive、thermal conductivity and adhesion. It is used for packaging power chips ，can replace the conventional SMT Tin soldering paste .Due to its good rheology, this material can be used to develop high-precision SMT pads by Die bonding machine or Steel Stencil printing machine. The special resin can support high adhesion reliability. high thermal conductivity, high electric conductivity and high thixotropic, and high adaptability to epoxy resin dispensing operation when SMT.