PHP9000-5F-G is a Nano-Sintering Conductive Copper Paste which used for interlayers Interconnection of PCB, with a electric resistivity≤ 7μΩ; The thermal conductivity is ≥ 200W/m.K, the performance is far better than the Copper-Tin type conductive copper paste, Nano alloy sintering technology is adopted to avoid the re-melting problem of the interface after tin alloy sintering, and the nano alloy sintering technology can develop and generate a high reliable interface miscibility, which can prevent from metal re-melting problems, develop a high-reliability interconnection between homogeneous materials. It can be applied to the interface heat dissipation as a  thermal management material of high-power semiconductor packaging devices.such like IGBT.

PHP9000-5F-G material with the following advantages:

1.as one kind of new interlayers interconnection solution, compared with traditional mechanical through-hole plating, chemical copper plating, electroplated copper and other metallization, PHP9000-5F-G is environmental friendly and green chemical material, one of innovative material of additive manufacturing technology.

2.Break through the limitation of the high aspect ratio of traditional heavy thick PCB, improve the high multi-layer alignment capability, production yield rate, etc.

3.Improve the flexibility of PCB design, realize different layers to layers interconnection and interconnection of different kind of material combinations in one PCBs.

4.Solve the compatibility problem of chemical copper plating and material.