PHP9000-5F-L is a low-temperature sintering, electric and thermal conductive copper paste .applied in the field of semiconductor packaging and layers to layers interconnection of printed circuit board, mainly used as via plugging material for micro PTH hole or blind holes, especially for the Z axis vertically interconnection between two circuits layers, particluar for high multilayer heavy thick board, backplane, automatic test equipment (ATE) boards of semiconductor test and any layers HDI .use in the process of automatic or manual via plugging which under non-vacuum working conditions. The electric resistivity of this material ≤ 30μΩ; Thermal conductivity≥ 20W/m.K.