PHP9000-3F-CK is a independent ingredient (No other ingredients are required to use) epoxy resin material ,halogen-free and environmentally friendly, no organic solvents, especially applied in stack up Voids Filling for inner and outer layer of heavy copper and Voids Filling for aluminum substrate groove of stack up with excellent heat dissipation, easy to grinding, excellent bubble remove(Deaeration) performance, good crack resistance, very strong adhesion with copper and resin of via , while low curing stress, effectively solve the problem of PCB twisting and warping, plugged via bubble escape performance is strong. This material is suitable applied for conventional printed plugged via and vacuum plugged via.