(General-purpose) Thermosetting, highly cross-linked core-shell structured CFL powder, primarily composed of acrylate copolymer, suitable for applications in digital devices, power systems, energy storage, etc. It exhibits excellent wet adhesion and provides robust electrode interface bonding. The powder can be processed through sand grinding to produce slurries with a D50 particle size ranging from 1–6 μm in various specifications, meeting diverse separator coating thickness requirements.