PHP9000 7F-L Conductive Adhesive Copper Paste has excellent electrical and thermal conductivity and adhesion, which is used in the packaging of power ICs or replace the convential solder tin paste. Due to its good rheology, it can be used to develop high-precision solder pads by die bonging machines or steel stencil printing machines. Special resin systems provide high adhesion reliability. high thermal conductivity, high electrical conductivity and high thixotropy, hihgh adaptability in epoxy resin dispensing operations when SMT.