Circuits development on special substrates is limited, such as the limitation of heat resistance, chemical resistance, surface shape, etc., therefore the traditional circuit development process or technology cannot be used on special substrates. Take advantage of the low temperature thermosetting conductive silver paste as circuit development basic material, can effectively match the production of electronic circuit through additive manufacturing process such as screen printing, paste extrusion and spraying. 

Circuits Development Conductive Silver Paste is a sintered silver paste with micro-nano composite silver powder as main ingredient, which is used for high precision circuits made by additive manufacturing. Due to low curing temperature and good electric conductivity, circuits and pads can be made on the surface of most organic or inorganic substrates. The special silver paste structure result in good solderability  and chemical plating.