DIJ-SR Series Inkjet Printing Solder Mask - Shenzhen Baroy New Material Technology Co., Ltd.

ProductsPCB Inkjet Printing MaterialPCB Inkjet Printing Solder Resist

DIJ-SR Series Inkjet Printing Solder Mask

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Product Introduction

DIJ-SR Series Inkjet Printing Solder Mask is the material and technology invented by Baroy Self-R&D independently, this solder mask it can rapid curing by mercury lamps, LED and other types of UV lamps , with excellent spraying performance, can well adapt to the continuous injection of industrial nozzles.

Product Advantage

No Volatile Organic Ingredient

Good storage settling stability, and good inkjet stability performance

Excellent printing image quality, and excellent solder mask performance

Meet the EU RoHS and REACH standard, environmentally friendly and halogen-free

No Volatile Organic Ingredient

Good storage settling stability, and good inkjet stability performance

Excellent printing image quality, and excellent solder mask performance

Meet the EU RoHS and REACH standard, environmentally friendly and halogen-free

Application Field

Can be used in standard or high-end multi-layers PCB solder mask, heavy copper PCB, HDI, phenolic CEM Series basic material PCB, glass fiber cloth FR4 PCB and so on.

Product Series

Product PNs	DIJ - SR100	DIJ - SR200	DIJ - SR300	DIJ - SR100 FG	DIJ - LG100
Color	Green//Black/White	Green//Black/White	Green//Black/White	Green/white	black
Adaptable Nozzle	KM1024i MHE KM1024i SHE KM1800i SHC	KM1024i MHE KM1024i SHE KM1800i SHC	Samba G3L	KM1024i MHE	KM1024i MHE
Application	PCB Copper Printing	PCB Copper Printing	PCB Copper Printing	PCB Voids Filling Printing	Printing On The Gold Face
Viscosity Cps 50 °c	＜14	＜14	＜10	＜10	＜14
Surface Tension mN/m	32--34	32--34	＞32	＞32	21-25
Particle Size Nm	＜500	＜500	＜500	＜500	＜500
Pre-Treatment Collocation	Super Coarse + Impermeable Chemical Cleaning	Super Coarse + Impermeable	Super Coarse + Impermeable	Super Coarse	Gold Face Cleaning
UV Energy	100-1000mj/cm2	100-1000mj/cm2	100-1000mj/cm2	100-1000mj/cm2	100-1000mj/cm2
Heat Curing	150℃*1h	150℃*1h	150℃*1h	150℃*1h	150℃*1h
Surface Treatment	HASL/OSP	Immersion Gold / Immersion Tin / Immersion Silver / HASL / OSP / Hard Gold/ENEPIG	Immersion Gold / Immersion Tin / Immersion Silver / HASL / OSP / Hard Gold/ENEPIG	/	/
Reliability	Reflow /Thermal Stress Qualified	Reflow /Thermal Stress Qualified	Reflow /Thermal Stress Qualified	Reflow /Thermal Stress Qualified	PCT/ No Crack-free by Ultrasound

Technical Data Sheet

Items	Testing Standard	Outcome
Appearance	IPC-SM-840C Customer Standards	Qualified
Adhesion	IPC-SM-840C IPC-TM-650 2.4.28.1	There is no separation of the coating film
Pencil Hardness	IPC-SM-840C IPC-TM-650 2.4.27.2	6H
100 Cell Test Adhesion	IPC-SM-840C IPC-TM-650 2.4.2	5B
Solvent Acid & Alkali Resistance	IPC-SM-840C	Qualified
Solderability/ Thermal Stress	IPC-SM-840C IPC-TM-650 2.6.8	There is no separation of the coating film
Thermal Shock	IPC-SM-840C IPC-TM-650 2.6.7.1	Qualified
Reflow Simulation	IPC-TM-650 2.6.27	There is no separation of the coating film
Voltage Withstand Hipot Test	IEC 60243-1-2013	The Measured < 1500VDC
Mechanical Test	IPC-TM-650 2.4.7	Qualified
Salt Spray Test	ASTM-B117-09	Qualified
Constant Temperature And Humidity Test	GB/T2423.3

Items	Testing Standard	Outcome
Appearance	IPC-SM-840C Customer Standards	Qualified
Adhesion	IPC-SM-840C IPC-TM-650 2.4.28.1	There is no separation of the coating film
Pencil Hardness	IPC-SM-840C IPC-TM-650 2.4.27.2	6H
100 Cell Test Adhesion	IPC-SM-840C IPC-TM-650 2.4.2	5B
Solvent Acid & Alkali Resistance	IPC-SM-840C	Qualified
Solderability/ Thermal Stress	IPC-SM-840C IPC-TM-650 2.6.8	There is no separation of the coating film
Thermal Shock	IPC-SM-840C IPC-TM-650 2.6.7.1	Qualified
Reflow Simulation	IPC-TM-650 2.6.27	There is no separation of the coating film
Voltage Withstand Hipot Test	IEC 60243-1-2013	The Measured < 1500VDC
Mechanical Test	IPC-TM-650 2.4.7	Qualified
Salt Spray Test	ASTM-B117-09	Qualified
Constant Temperature And Humidity Test	GB/T2423.3

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