PHP9000-3F-L is a highly reactive and independent ingredient (No other ingredients are required when use, Single-Component Formula) epoxy resin material, halogen-free and environmentally friendly, no contain organic solvents, good resin separation performance in the process of silk or aluminum scrape and printing, high stability and no bubbles or cavities during silk or aluminum screen printing process as well. This material is used in high density plugged via selection, with high temperature resistance, high reliability, excellent hardness, easy to grinding, without dent or depression after electroplating process, good flatness performance, very strong adhesion with copper and resin of via. Suitable for high-frequency and high-speed PCB.