PHP9000-5F-DR is one kind of plugged via resin for PCB via insulation and heat dissipation, halogen-free and environmentally friendly material, no organic solvents, Thermosetting type resin especially developed for the thermal conductivity and heat dissipation, Meet the application needs of high-frequency PCBs and high-power PCBs which applied in 5G telecom and networks equipment’s. it has good flowability and excellent via plugging performance in vacuum working condition ,high thermal conductivity and high reliability after curing. No other ingredients are required when use, Single-Component Formula , much more convenient when use, excellent hardness, easy to grinding, without depression or dent after plating, good flatness and evenness, ultra-low coefficient of thermal expansion and high dimensional stability in size, no cracks, excellent SMT bonding performance and chemical corrosion resistance, good connection reliability with re-plated copper or second plating copper.