PHP9000-4F Plugged Via Resin - Shenzhen Baroy New Material Technology Co., Ltd.

ProductsPCB Plugged Via MaterialHigh Performance Plugged Via Resin

PHP9000-4F Plugged Via Resin

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Product Introduction

PHP9000-4F resin is one kind of halogen-free and environmentally friendly material, no organic solvents, is conventional plug via green resin, is a kind of ordinary horizontal plugging resin, stable performance , high cost effectiveness, easy to grinding performance; dedicated for plug via resin of PCB outer layers to compensate for the cavities, bubbles and cracks quality problem which caused by the traditional photosensitive green ink plug via.

Product Advantage

Single-Component Formula

High Reliability

Excellent Adhesion Performance

Single-Component Formula

High Reliability

Excellent Adhesion Performance

Application Field

PHP9000-4F resin can be used for ordinary horizontal via plugging ,can replace the conventional green ink via plugging process, dedicated for HDI and ordinary outer resin plugged via.

Product Series

Technical Data Sheet

	Specification	Testing Method	Standard Reference	Test Result
1	Appearance	Visual Inspection	/	Light Gray White(adjustbale to be green color)
2	Solid Content	Termogravimetry	GB 1725-79	100%
3	Glass Transition	TMA（℃）	IPC-TM-650 2.4.24	130-150
3	Temperature	TMA（℃）	IPC-TM-650 2.4.24	130-150
4	Coefficient Of Thermal Expansion	TMA（＜Tg） α1（ppm）	IPC-TM-650 2.4.24	45-60
	Coefficient Of Thermal Expansion	TMA（＞Tg） α2（ppm）	IPC-TM-650 2.4.24	115-130
5	260℃	TMA Thermal Analysis(%)	IPC-TM-650 2.4.24	1.9-2.2
	Overall Coefficient Of Thermal
	Expansion
6	Coefficient of Water Absorption	Gravimetric Analysis （%）	IPC-TM-650 2.6.2.1	≤0.15
7	Hardness	Pencil	IPC-TM-650 2.4.27.2	≥6H
8	Insulation Resistance	Voltage（Ω）	GB/T 10064-2006	1-3*10¹³
8	Insulation Resistance	Voltage（Ω）	GB/T 10064-2006	1-3*10¹³
9	Thermal Conductivity	Steady-State Analysis （W/m.k）	ASTM D5470-2012	0.5-0.7
10	Dielectric Constant	Separated Dielectric Resonance Test（5GHz）	ASTM-D15012	3.4-4.0
11	Dielectric Loss	Separated Dielectric Resonance Test（5GHz）	ASTM-D15012	0.01-0.02
12	Adhesion	100 cell test Adhesion +3M Tape	IPC-TM-650 2.4.1	100/100
13	Heat Resistance	Reflow Soldering Testing 260℃.60sec.3 Cycles	IPC-TM-650 2.1.1.2	Pass
	Heat Resistance	Thermal Stress 288℃.10sec.5 Cycles	IPC-TM-650 2.6.8	Pass
14	Chemical Corrosion	10wt% NaOH 25℃*30min	IPC-TM-650 2.3.4.3	Pass
	Resistance

15	TCT Testing	-50℃/30min+150℃/30min	IPC-TM-650 2.6.7.2	Pass
15	TCT Testing	1000 Cycles	IPC-TM-650 2.6.7.2	Pass

	Specification	Testing Method	Standard Reference	Test Result
1	Appearance	Visual Inspection	/	Light Gray White(adjustbale to be green color)
2	Solid Content	Termogravimetry	GB 1725-79	100%
3	Glass Transition	TMA（℃）	IPC-TM-650 2.4.24	130-150
3	Temperature	TMA（℃）	IPC-TM-650 2.4.24	130-150
4	Coefficient Of Thermal Expansion	TMA（＜Tg） α1（ppm）	IPC-TM-650 2.4.24	45-60
	Coefficient Of Thermal Expansion	TMA（＞Tg） α2（ppm）	IPC-TM-650 2.4.24	115-130
5	260℃	TMA Thermal Analysis(%)	IPC-TM-650 2.4.24	1.9-2.2
	Overall Coefficient Of Thermal
	Expansion
6	Coefficient of Water Absorption	Gravimetric Analysis （%）	IPC-TM-650 2.6.2.1	≤0.15
7	Hardness	Pencil	IPC-TM-650 2.4.27.2	≥6H
8	Insulation Resistance	Voltage（Ω）	GB/T 10064-2006	1-3*10¹³
8	Insulation Resistance	Voltage（Ω）	GB/T 10064-2006	1-3*10¹³
9	Thermal Conductivity	Steady-State Analysis （W/m.k）	ASTM D5470-2012	0.5-0.7
10	Dielectric Constant	Separated Dielectric Resonance Test（5GHz）	ASTM-D15012	3.4-4.0
11	Dielectric Loss	Separated Dielectric Resonance Test（5GHz）	ASTM-D15012	0.01-0.02
12	Adhesion	100 cell test Adhesion +3M Tape	IPC-TM-650 2.4.1	100/100
13	Heat Resistance	Reflow Soldering Testing 260℃.60sec.3 Cycles	IPC-TM-650 2.1.1.2	Pass
	Heat Resistance	Thermal Stress 288℃.10sec.5 Cycles	IPC-TM-650 2.6.8	Pass
14	Chemical Corrosion	10wt% NaOH 25℃*30min	IPC-TM-650 2.3.4.3	Pass
	Resistance

15	TCT Testing	-50℃/30min+150℃/30min	IPC-TM-650 2.6.7.2	Pass
15	TCT Testing	1000 Cycles	IPC-TM-650 2.6.7.2	Pass

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